Language:en
  • zh-cn
  • en

Huizhong Dingtai

Product Details
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FET-G2LD-C 122GOE16M16GIB11
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FET-G2LD-C 122GOE16M16GIB11
Model FORLINX-FET-G2LD-C 122GOE16M16GIB11
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Forlinx Embedded
Description Renesas RZ/G2L
Encapsulation -
Package Tape & Box (TB)
RoHS Status 1
Price: $70.0000
Enter Quantity

Quantity

Price

Total Price

1

$70.0000

$70.0000

Obtain quotation information
image of Microcontrollers, Microprocessor, FPGA Modules>21810682
21810682
Model
21810682
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Forlinx Embedded
Description
Renesas RZ/G2L
Encapsulation
-
Package
Tape & Box (TB)
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 240
Size / Dimension1.496" L x 2.360" W (38.00mm x 60.00mm)
Speed1.2GHz
RAM Size2GB
Operating Temperature-40°C ~ 85°C
Module/Board TypeMPU
Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33
Flash Size16GB eMMC,16MB (NOR)
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
+86-19926599677

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
点击这里给我发消息
0