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  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX6ULL-C 08512SE8GIA11
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX6ULL-C 08512SE8GIA11
Model FORLINX-FETMX6ULL-C 08512SE8GIA11
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Forlinx Embedded
Description NXP i.MX6ULLSOM
Encapsulation -
Package Tape & Box (TB)
RoHS Status 1
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Price: $31.0000
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image of Microcontrollers, Microprocessor, FPGA Modules>21810731
21810731
Model
21810731
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Forlinx Embedded
Description
NXP i.MX6ULLSOM
Encapsulation
-
Package
Tape & Box (TB)
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 160
Size / Dimension1.570" L x 1.142" W (40.00mm x 29.00mm)
Speed800MHz
RAM Size512MB
Operating Temperature-40°C ~ 85°C
Module/Board TypeMPU
Core ProcessorARM® Cortex®-A7
Flash Size8GB eMMC
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