Language:en
  • zh-cn
  • en

Huizhong Dingtai

Product Details
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MM-C 182GSE8GCA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MM-C 182GSE8GCA10
Model FORLINX-FETMX8MM-C 182GSE8GCA10
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Forlinx Embedded
Description NXP i.MX8M Mini
Encapsulation -
Package Tape & Box (TB)
RoHS Status 1
Obtain quotation information
Price: $65.0000
Enter Quantity

Quantity

Price

Total Price

1

$65.0000

$65.0000

image of Microcontrollers, Microprocessor, FPGA Modules>21810681
21810681
Model
21810681
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Forlinx Embedded
Description
NXP i.MX8M Mini
Encapsulation
-
Package
Tape & Box (TB)
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 240
Size / Dimension2.200" L x 1.417" W (56.00mm x 36.00mm)
Speed1.8GHz
RAM Size2GB
Operating Temperature0°C ~ 70°C
Module/Board TypeMPU
Core ProcessorARM Cortex-A53, ARM® Cortex®-M4F
Flash Size8GB eMMC
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
+86-19926599677

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
点击这里给我发消息
0