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  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MM-C 182GSE8GCA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MM-C 182GSE8GCA10
Model FORLINX-FETMX8MM-C 182GSE8GCA10
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Forlinx Embedded
Description NXP i.MX8M Mini
Encapsulation -
Package Tape & Box (TB)
RoHS Status 1
Price: $65.0000
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image of Microcontrollers, Microprocessor, FPGA Modules>21810681
21810681
Model
21810681
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Forlinx Embedded
Description
NXP i.MX8M Mini
Encapsulation
-
Package
Tape & Box (TB)
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 240
Size / Dimension2.200" L x 1.417" W (56.00mm x 36.00mm)
Speed1.8GHz
RAM Size2GB
Operating Temperature0°C ~ 70°C
Module/Board TypeMPU
Core ProcessorARM Cortex-A53, ARM® Cortex®-M4F
Flash Size8GB eMMC
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