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  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0803-04-4GE21-L
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0803-04-4GE21-L
Model TE0803-04-4GE21-L
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MPSOC MODULE WI
Encapsulation -
Package Bulk
RoHS Status 1
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Price: $712.0000
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image of Microcontrollers, Microprocessor, FPGA Modules>20418009
20418009
Model
20418009
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Description
MPSOC MODULE WI
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesTE0803
PackageBulk
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 160
Size / Dimension2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size4GB
Operating Temperature0°C ~ 85°C
Module/Board TypeMPU Core
Core ProcessorZynq™ UltraScale+™ XCZU4EG-2SFVC784E
Flash Size128MB
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