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Product Details
  • image of Memory>W66BP6NBHAGJ
  • image of Memory>W66BP6NBHAGJ
Model W66BP6NBHAGJ
Product Category Memory
Manufacturer Winbond Electronics Corporation
Description 2GB LPDDR4, X16
Encapsulation -
Package Tray
RoHS Status
Obtain quotation information
Price: $6.1300
Enter Quantity

Quantity

Price

Total Price

1

$6.1300

$6.1300

10

$5.5400

$55.4000

25

$5.2800

$132.0000

80

$4.5800

$366.4000

230

$4.3800

$1,007.4000

440

$3.9900

$1,755.6000

945

$3.4800

$3,288.6000

2400

$3.3500

$8,040.0000

image of Memory>22146334
22146334
Model
22146334
Product Category
Memory
Manufacturer
Winbond Electronics Corporation
Description
2GB LPDDR4, X16
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case100-VFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency1.867 GHz
Memory FormatDRAM
Supplier Device Package100-VFBGA (10x7.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization128M x 16
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