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  • image of System On Chip (SoC)>XCVE1752-1MSIVSVA2197
  • image of System On Chip (SoC)>XCVE1752-1MSIVSVA2197
Model XCVE1752-1MSIVSVA2197
Product Category System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSAL AI-CO
Encapsulation -
Package Tray
RoHS Status 1
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Price: $21,405.0000
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image of System On Chip (SoC)>18627027
18627027
Model
18627027
Product Category
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Description
IC VERSAL AI-CO
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case2197-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Edge FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package2197-FCBGA (45x45)
ArchitectureMPU, FPGA
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